Institutional-Repository, University of Moratuwa.  

A monitoring method for the degree of curing in epoxy adhesives using direct current resistivity

Show simple item record

dc.contributor.author Janith, GI
dc.contributor.author Herath, WHS
dc.contributor.author Weragoda, VSC
dc.contributor.editor Abeygunawardana, AAGA
dc.date.accessioned 2022-12-12T09:50:45Z
dc.date.available 2022-12-12T09:50:45Z
dc.date.issued 2022-11
dc.identifier.citation ********** en_US
dc.identifier.uri http://dl.lib.uom.lk/handle/123/19780
dc.description.abstract Adhesive bonding is a widely used technique in material joining. Research focused on enhancing the properties of resin-based adhesive systems is critically important in manufacturing quality control. One specifically important aspect is the monitoring of cure progression of the adhesive. Commonly practiced cure monitoring methods such as Differential Scanning Calorimetry (DSC), Dielectric Analysis (DEA) and Dynamic Mechanical Analysis (DMA) are ideal for laboratory evaluations but not conducive for in-situ cure monitoring. In-situ cure monitoring techniques are vital as they provide better control over processing parameters. This study introduces a Direct Current Resistivity (DCR) based cure monitoring method. It is simple, cost-effective, reliable, and more importantly, industry friendly. The fast response of direct current measurements combined with the simplicity of the analysis makes this method suitable for real-time cure monitoring. en_US
dc.language.iso en en_US
dc.publisher Department of Materials Science and Engineering, University of Moratuwa. en_US
dc.subject Adhesive bonding en_US
dc.subject Epoxy adhesive en_US
dc.subject Cure monitoring en_US
dc.title A monitoring method for the degree of curing in epoxy adhesives using direct current resistivity en_US
dc.type Conference-Abstract en_US
dc.identifier.faculty Engineering en_US
dc.identifier.department Department of Materials Science and Engineering, University of Moratuwa en_US
dc.identifier.year 2022 en_US
dc.identifier.conference Materials Engineering Symposium on Innovations for Industry 2022 en_US
dc.identifier.place Moratuwa, Sri Lanka. en_US
dc.identifier.pgnos p. 1 en_US
dc.identifier.proceeding Towards Smart Society through Innovative Materials en_US
dc.identifier.email sampathw@uom.lk en_US


Files in this item

This item appears in the following Collection(s)

Show simple item record